Keep exploring and forging ahead，Closely combined with electronic information, computers, machinery and materials and other high-tech development achievements，Use modern management techniques，Improve chip packaging research and development, design, manufacturing, online testing and other advanced manufacturing capabilities，Achieve high quality, high efficiency, low consumption and flexible production，Help customers reduce the risk of film loss，Reduce the key size of the chip，Improve chip performance，Shorten the chip development cycle，Reduce customer costs。

laboratoryHave professional and sound failure analysis equipment andVarious reliability test equipment, such as cold and hot shock box, constant temperature and humidity box, high temperature oven, high acceleration aging test box, etc., provide customers with professional reliability programs to ensure that products pass reliability evaluation in the development stage and meet customer product reliability indicators。

Provide a full range of chip packaging and testing one-stop services, its products, services and technologies cover the mainstream integrated circuit system applications, including network communications, mobile terminals, high-performance computing, vehicle electronics, big data storage, artificial intelligence and Internet of things, industrial intelligence and other fields。