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CSP package
Product center
Chiplet encapsulation
SiP encapsulation
CSP package
Frame encapsulation
fcBGA package
Overmolding full molding encapsulation
It is suitable for the common packaging form of chip products in consumer, industrial and other industries, with good air tightness and reliability, high cost performance, and wide audience。
Openmolding chip exposed molding package
The plastic sealing solution of the exposed surface of the chip is suitable for FlipChip chip products, fingerprint module products, MEMS products, etc., which have ultra-high heat dissipation requirements。