RfcBGA encapsulation
Filp Chip flip welding package products, support 4~16 layer substrate structure, support ABF/PP two packaging schemes, support single chip, multi-chip integrated package structure, support 0.76mm/0.50mm/0.30mm/0.40mm/0.25mm package ball structure with different diameters。Especially suitable for all kinds of server core devices, computing power production...