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Openmolding chip exposed molding package
Product introduction

The plastic sealing solution of the exposed surface of the chip is suitable for FlipChip chip products, fingerprint module products, MEMS products, etc., which have ultra-high heat dissipation requirements。

Technological advantage

① The upper surface of the chip is exposed, and it can be directly connected to the cooling system, and the heat dissipation performance is excellent。

② Suitable for special application scenarios that require the chip surface to be exposed。