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QFN/DFN package (Quad Flat No-lead Package)
Product introduction

Four-sided flat pin-free package can be used in various fields, such as computer, communication, consumer electronics, automotive electronics, etc., is a kind of packaging technology with wide application prospects。

Technological advantage

① Excellent thermal performance and reliability, can pass MSL level1 test。

② Especially suitable for consumer, vehicle, military and other types of products with high cost performance and high reliability requirements。

③ Support single chip/multi-chip package scheme。